HCH Type Fully Automatic Nitrogen Purification Equipment
The HCH type fully automatic nitrogen purification equipment
utilizes advanced adsorption technology to remove oxygen, water,
and impurities from nitrogen gas. Starting with 99.9% purity
nitrogen as raw material, the system employs carbon and specialized
catalysts to achieve superior purification results.
Working Principle
The HCH type nitrogen purification equipment employs a
sophisticated combination of hydrogenation catalytic deoxygenation
and molecular sieve deep drying processes, specifically engineered
for SMT reflow soldering applications. Ordinary nitrogen enters the
system and is precisely mixed with trace amounts of hydrogen before
being directed to the catalytic reaction tower. Under the influence
of specialized catalysts, residual oxygen in the nitrogen reacts
with hydrogen to form water, effectively completing the
deoxygenation process.
Following deoxygenation, the gas undergoes initial condensation to
remove water content and then proceeds to the molecular sieve
drying system for deep removal of residual water vapor and minor
impurities. The molecular sieve features an automatic regeneration
system capable of continuous cyclic operation, ensuring 24-hour
uninterrupted equipment performance.
After completing the comprehensive purification process, the system
produces high-purity, low dew point nitrogen gas. All output
parameters meet the stringent requirements for SMT reflow soldering
oxygen-free applications, effectively preventing PCB pad oxidation
and ensuring superior soldering quality.
Equipment Introduction
The HCH type nitrogen purification equipment represents a high-end
gas purification solution developed specifically for the electronic
precision welding industry. As a mainstream SMT-specific nitrogen
purifier, it serves as the core supporting equipment for reflow
soldering systems, perfectly adapting to various lead-free reflow
soldering production lines. This system effectively addresses
common issues of insufficient gas supply purity and excessive water
and oxygen content in standard nitrogen generators, providing
stable high-purity protective nitrogen for SMT manufacturing
processes.
This SMT reflow soldering nitrogen purification equipment utilizes
mature catalytic deoxygenation and molecular sieve deep drying
purification technologies. Using industrial-grade common nitrogen
as raw material, the system removes residual oxygen through
efficient catalytic reactions, followed by multi-stage adsorption
drying treatment to deeply eliminate water vapor, impurities, and
trace gas contaminants. The HCH type equipment consistently
produces high-purity nitrogen with purity levels ≥ 99.999%,
featuring extremely low oxygen content and dew points reaching
-70°C. This performance completely eliminates common soldering
issues including PCB oxidation, virtual soldering, blackening, and
color variations, significantly improving surface mount soldering
yield rates.
The HCH type nitrogen purification equipment features an integrated
design with compact structure, minimal footprint, and
straightforward installation, making it suitable for various
factory workshop configurations. Equipped with a fully automatic
intelligent control system, the equipment achieves automatic
nitrogen-hydrogen ratio adjustment, automatic regeneration, and
real-time operational monitoring. Supporting 24-hour continuous
stable gas supply without requiring manual supervision, the system
is ideally suited for high-intensity continuous production
environments typical of SMT assembly lines.
Compared to traditional purification equipment, the HCH system
offers extended catalyst service life, stable purification
performance, low energy consumption, simple operation and
maintenance procedures, and minimal failure rates. These advantages
effectively reduce both gas and equipment maintenance costs for
enterprises. With exceptional purification efficiency and reliable
operational performance, this equipment finds widespread
application in SMT surface mount processing, precision electronic
soldering, semiconductor packaging, and related fields, serving as
core supporting equipment for enhancing reflow soldering process
quality and efficiency while stabilizing production output.
Technical Specifications
| Model | Output | Oxygen Purity | Dimensions (L*W*H mm) | Air Inlet | Gas Outlet | Weight (kg) | Power Supply |
|---|
| HN4010 | 10Nm³/h | ≥93% | 1300*950*1850 | G1/2" | G1/2" | 500 | AC220V/0.2KW |
| HN4020 | 20Nm³/h | ≥93% | 1400*950*1850 | G1" | G1/2" | 600 | AC220V/0.2KW |
| HN4030 | 30Nm³/h | ≥93% | 1500*950*1850 | G1" | G1/2" | 700 | AC220V/0.2KW |
| HN4040 | 40Nm³/h | ≥93% | 1600*1000*2000 | G1" | G1/2" | 800 | AC220V/0.2KW |
| HN4050 | 50Nm³/h | ≥93% | 1600*1200*2200 | G1" | G1/4" | 1000 | AC220V/0.2KW |
| HN4060 | 60Nm³/h | ≥93% | 1600*1200*2200 | G1" | G1" | 1200 | AC220V/0.2KW |
| HN4080 | 80Nm³/h | ≥93% | 1800*1400*2500 | G1" | G1" | 1600 | AC220V/0.2KW |
| HN4100 | 100Nm³/h | ≥93% | 2000*1600*2600 | DN32 | G1" | 1800 | AC220V/0.2KW |
| HN4150 | 150Nm³/h | ≥93% | 2200*1600*2700 | DN40 | G1" | 2400 | AC220V/0.2KW |
| HN4200 | 200Nm³/h | ≥93% | 2300*1600*2700 | DN50 | DN40 | 3000 | AC220V/0.2KW |
| HN4250 | 250Nm³/h | ≥93% | 2400*1600*2700 | DN50 | DN40 | 4000 | AC220V/0.2KW |
| HN4300 | 300Nm³/h | ≥93% | 2500*1600*2760 | DN65 | DN40 | 5600 | AC220V/0.2KW |
| HN4400 | 400Nm³/h | ≥93% | 2700*1800*2900 | DN65 | DN50 | 6500 | AC220V/0.2KW |
| HN4500 | 500Nm³/h | ≥93% | 3200*2400*3900 | DN80 | DN65 | 7500 | AC220V/0.2KW |
| HN4600 | 600Nm³/h | ≥93% | 3500*2500*4000 | DN80 | DN65 | 8500 | AC220V/0.2KW |
| HN4700 | 700Nm³/h | ≥93% | 3500*2500*4500 | DN100 | DN80 | 9500 | AC220V/0.2KW |
| HN4800 | 800Nm³/h | ≥93% | 3800*2600*4500 | DN100 | DN80 | 11000 | AC220V/0.2KW |
| HN4900 | 900Nm³/h | ≥93% | 3800*2600*5200 | DN100 | DN80 | 12000 | AC220V/0.2KW |
| HN41000 | 1000Nm³/h | ≥93% | 4000*2800*5500 | DN100 | DN80 | 15000 | AC220V/0.2KW |
Safety Precautions
- Gas protection equipment contains nitrogen and hydrogen. Nitrogen
can cause hypoxia and suffocation, while hydrogen is flammable and
explosive. Maintain adequate ventilation in work areas and strictly
prohibit open flames and smoking. Regularly inspect pipelines for
leaks and post appropriate danger warning signs.
- Operate strictly within rated working pressure limits; overpressure
operation is prohibited. Open and close valves slowly to avoid
pressure shock. Unauthorized personnel should not modify equipment
or pipelines.
- Ensure equipment is reliably grounded. Do not open electrical
control boxes during operation. Before maintenance, disconnect
power and relieve pressure. Regularly inspect electrical circuits
to prevent aging and leakage issues.
- Before startup, check instruments, valves, and safety valves as
part of daily operation and maintenance procedures. Monitor
operational parameters continuously. Immediately shut down
equipment if abnormal noise, overheating, or leakage occurs.
Replacement of catalysts, molecular sieves, and other accessories
must be performed with the machine shut down and power
disconnected.
After-Sales Service Guarantee
- The complete machine carries a 12-month warranty with extended
warranty coverage for core components. During the warranty period,
repairs and part replacements for non-human caused faults are
provided free of charge.
- 24/7 technical consultation services with rapid response to faults
and on-site maintenance as required.
- Complimentary on-site installation, debugging, and comprehensive
operation and maintenance training.
- Lifelong technical support provided after warranty expiration, with
long-term supply of original spare parts.
Certification
Contact Information
